Organizers:

Representative

Co-Organizers

Correspondence

Scope:

Plating is an age old technology that remains useful today offering a low energy/ low environmental impact solution for device production and functionalization. Despite it’s long history, many aspects remain for development and adaption to engineer unique materials and solutions that will create gateways for new technology to meeting future demands like higher density electronics and high frequency transission. One example is use in laminated MEMS built on packaging technology that are being developed for smart high frequency antenaes. This symposium focuses on new advances in plating and surface engineering geared towards science, materials and solutions that are applied in next gereration electronics with consideration of the global climate.

Topics:

• Metallization of leading candidate substrates for next generation electronic devices.
• Bottom up filling of via holes and through holes for high density electronics.
• Chemistry and surface distribution of additives for functional plating.
• Cyanide free electro and electroless gold and silver plating baths.
• Deposition of new materials for next generation electronic devices.
• Co-deposition plating for composite coating.
• Photo-functionalization for smooth conductor surfaces used in high frequency electronics
• Plating technology application to laminated MEMS.
• Modification of plastics by ozone in water as an environmentaly friendly alternative for plated metal adhesion.
• Fine patterning and formation of printed circuits.