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The 28th Annual Meeting of MRS-J Program List: Poster

C-3:Frontier of Nano-Materials Based on Advanced Plasma Technologies

Entry No Presentation Date Award Presenter Name Affiliation Paper Title
Dec. 18
16:10 - 18:00
北九州国際会議場　イベントホール
Kitakyushu International Conference Center Event Hall
2014   C3-P18-001 Dec. 18  Hiroharu KAWASAKI National Institute of Technology, Sasebo College Two-dimensional Thin Film Preparation by Sputtering Deposition using Powder Targets　
2201   C3-P18-002 Dec. 18  Masanori SHINOHAR National Institute of Technology, Sasebo College Plasma enhanced chemical vapor deposition of amorphous carbon film with ether as a source molecule
2408   C3-P18-003 Dec. 18  Masahiro SUGIYAMA Graduate School of Integrated Science and Technology, Shizuoka Univ. Rapid Desulfurization by MW Hydrogen Plasma of CVD-grown MoS2 Thin Film
2540   C3-P18-004 Dec. 18  *B Hiroaki YABE Faculty of Engineering, Chiba Institute of Technology Influences of O2 Gas Mixture on Properties of SiO:CH Films Deposited by PECVD
2549   C3-P18-005 Dec. 18  *M Hisayuki HARA Graduate School of Information Science and Electrical Engineering, Kyushu University Effects of cluster-eliminating filter and gas velocity on SiH2 bond formation in a-Si:H films deposited by MHDPCVD method
2555   C3-P18-006 Dec. 18  *M Shota ISHIKAWA Nagoya University Organic-matter removal treatment using atmospheric pressure microwave O2/CF4 plasma
2669   C3-P18-007 Dec. 18  *M Kazuma TANAKA Kyushu University Effects of film deposition precursors on Raman intensity ratio ITA/ITO of a-Si:H thin films fabricated by plasma CVD method
2672   C3-P18-008 Dec. 18  *D Sung hwa HWANG Kyushu university Size and Structure Control of Carbon Nano-particles Synthesized by Multi-hollow Discharge Plasma CVD Method
2691   C3-P18-009 Dec. 18  *M Hiroshi OHTOMO Kyushu University Evaluation of potential distribution using a fine particle in Ar plasma
2702   C3-P18-010 Dec. 18  Masaharu Shiratani Kyushu University Spatial distribution of position fluctuation of optically trapped fine particle in Ar plasma
2782   C3-P18-011 Dec. 18  *M Yuki MIWA Meijo University Deposition of Si-doped DLC film by high power impulse magnetron sputtering
2830   C3-P18-012 Dec. 18  Kazunori KOGA Kyushu University Influence of Ar + CH4 Gas Flow Rate on Size of Carbon Nano-Particles Fabricated using High Pressure Multi-Hollow Discharge Plasma CVD Process
2908   C3-P18-013 Dec. 18  Taisuke KAWAZOE Interdisciplinary Graduate School of Engineering Science, Kyushu University Optimum ozone CT value for agricultural sterilization by plasma
2911   C3-P18-014 Dec. 18  *B Hiroki TANO Chiba Institute of Technology Electrochromic Properties of WO3 Films Sputtered with Glancing-angle Deposition Scheme
2913   C3-P18-015 Dec. 18  *M Muhammad AMINURUL HELMY Graduate School of Engineering, Okayama University of Science Influence of Gas Presence under Frequency Change on the Friction Abrasion Characteristics of ta-C:H Film Deposited by Cathodic Vacuum Arc Deposition Method
2916   C3-P18-016 Dec. 18  *M Hiroyuki FUKUE Graduate School of Engineering, Okayama University of Science Development of DLC Deposition Technology using HF-HiPIMS Power Supply System
2928   C3-P18-017 Dec. 18  Jun-seok OH Osaka City University Spectroscopic Investigation of Pressure Gradient Sputtering System
2973   C3-P18-018 Dec. 18  *M Masayuki NAKAMURA Meijo University Gas phase diagnostics on TiN film formation process using high power impulse magnetron sputtering
3003   C3-P18-019 Dec. 18  Kosuke TAKENAKA Joining and Welding Research Institute, Osaka University Positive-current-bias Instability of Post-deposition Plasma-treated IGZO TFTs Prepared with Plasma-assisted Reactive Sputtering
3061   C3-P18-020 Dec. 18  Yoshiki YAMAGUCHI Department of Electronic Engineering, Tohoku University Plasma functionalization of indium tin oxide for fabrication of transparent solar cell using few-layered transition metal dichalcogenide
3179   C3-P18-021 Dec. 18  Tamiko OHSHIMA National Institute of Technology, Sasebo College Film deposition by mixed powder target using powders with different sputtering conditions